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Manufacturer: Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Description: CSSP3 DPX CU-FRAME
Package: 9-SMD, No Lead
Quantity Available: Over 220,000 pieces
Best price for B39162B4340P810 (Email: sales@buy-tdk.com)
Product Parameters
- Manufacturer Part Number : B39162B4340P810
- Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
- Description : CSSP3 DPX CU-FRAME
- Packaging : Tape & Reel (TR)
- Series : *
- Part Status : Active
- Frequency - Center : -
- Bandwidth : -
- Insertion Loss : -
- Ratings : -
- Applications : -
- Mounting Type : Surface Mount
- Package / Case : 9-SMD, No Lead
- Height (Max) : 0.018" (0.45mm)
- Size / Dimension : 0.079" L x 0.063" W (2.00mm x 1.60mm)
- Other Part Number : B39162B4340P810-ND
- Delivery Time: Ship within 1 day.
- Manufacturer Production time: 6-8 weeks
- Weight: 0.0001 KG
Request Quotation for B39162B4340P810
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